The high-speed BFT-P V4 mold-carrier system is the ideal candidate for any encapsulation applications that feed the foam into the open mold. The lower part of the mold is easy to place in an optimum position for a robot to feed the foam.
In addition, the BFT-P V4 stands out due to its excellent ergonomics and absolute energy efficiency. Free access at the rear and at the front facilitates the integration of feeding and withdrawal systems for inserts, components and moulds.
|Mold carrier system||BFT-P V4 16×11|
|mould mounting plate – width||1600 mm|
|mould mounting plate – depth||1100 mm|
|closing force||≤ 400 kN|
|parallel stroke||1300 mm|
|tilting angle, upper mold mounting plate||0 – 90°|
|tilting angle, lower mold mounting plate||0 – 40°|
|closing and opening times||4s|
|swivelling of tower||± 30°|
|permissible mold mass, top||1000 kg|
|permissible mold mass, bottom||1500 kg|
|fitting dimension||400 – 900 mm|