This mold-carrier system was specifically developed for use in the production of components on the basis of the CSM (compound spray molding) or LFI (long-fibre injection) processes.
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|Mold carrier system||BFT-R 16×11||BFT-R 20x14|
|carrier clamping plate (FAP) width||1600 mm||2000 mm|
|carrier clamping plate (FAP) depth||1100 mm||1400 mm|
|parallel stroke||300 mm||500 mm|
|tilting upper FAP||45°||40°|
|tilting lower FAP||28°||40°|
|closing force max.||2500 kN||4000 kN|
|load max. upper FAP||3000 kg||5500 kg|
|load max. lower FAP||4000 kg||5500 kg|
|fitting dimension||500 mm||500 mm|